What factors affect the structure of the electroplating layer of the seedbed net
The composition of the seedbed net made from the electroplating solution has an important influence on the structure of the electroplating layer of the seedbed net, and its main composition is as follows. The primary salt is capable of depositing the desired salt of the coating metal on the cathode. The complexing agent can form a complex with the metal ions accumulated in the solution. Conductive salts can improve the conductivity of the solution, but have no effect on the discharge of metal ions. Buffers are used to stabilize the pH of the solution, especially near the surface of the cathode.
Stabilizers avoid hydrolysis of major salts in the bath or oxidation of metal ions, maintaining solution clarity and stability. Anode activators can eliminate or reduce anode polarization during electroplating. It can promote the normal dissolution of the anode and increase the anode current density. The content of additives in the bath is very low, which has a significant effect on the properties of the bath and coating. For example: brighteners, leveling agents, wetting agents, stress relievers, coating scavengers, fog inhibitors, etc.